Research on surface temperature of building envelope measured by thermal infrared imager

Wang Yangyang, Fang Xiumu, Li Yanping, Zhang Baoli, Li Deying, Wang Suilin

2015.02.04

Points out the shortage of “point for area” in commonly used average temperature measurement methods and the characteristics of solid surface temperature distribution in buildings. By using the thermal infrared spectrum of the building envelope surfaces, analyses the errors resulted from selection of the characteristic points and the area division. The research indicates that the thermal infrared spectrum correctly reflects the temperature distribution, solving the puzzle of the average temperature measurement on solid surfaces. Combining application of the point temperature method and thermal infrared imager can realize higher precision in the temperature measurement and deserves to be recommended.